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Electrical Conductive Adhesives with Nanotechnologies

Li   Lu, Daniel   Wong, C P
English | Hardcover

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

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Product information "Electrical Conductive Adhesives with Nanotechnologies"

"Electrical Conductive Adhesives with Nanotechnologies" begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

H | W | D | g
241 mm | 161 mm | 32 mm | 0.833 kg
Publication year
2009
Edition
2010
Age rating
0
Edition
Hardcover
Publisher
Springer Us
ISBN-10
0387887822
ISBN-13
9780387887821
Author
Li; Lu, Daniel; Wong, C P
Language
Englisch
Page Count
437
Topics
Schaltkreise und Komponenten Bauteile, Nanotechnologie, Technische Anwendung von elektronischen, magnetischen, optischen Materialien
Keywords
TECHNOLOGY & ENGINEERING / Optics, Schaltkreise und Komponenten (Bauteile), Nanotechnologie, TECHNOLOGY & ENGINEERING / Nanotechnology & MEMS, Technische Anwendung von elektronischen, magnetischen, optischen Materialien, TECHNOLOGY & ENGINEERING / Electronics / Circuits / General, TECHNOLOGY & ENGINEERING / Materials Science / Electronic Materials, HC/Theoretische Physik, TECHNOLOGY & ENGINEERING / Electronics / Microelectronics
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